Hardware Reference Guide

The Qualcomm® Robotics RB1 and Qualcomm® Robotics RB2 Development kits expand upon the 96Boards Consumer Edition (CE) Specification. They offer flexible options for development and commercialization. The development boards offer prototyping, off-the-shelf SOM solutions to speed commercialization, and flexibility for chip-on-board designs.

The Qualcomm Robotics RB1 and Qualcomm Robotics RB2 development kits consist of the Qualcomm® QRB2210 and Qualcomm® QRB4210 SOMs respectively. The SOMs are soldered down onto the interposer board and mounted on the robotics main board, which houses many peripheral interfaces and a robust expansion interface that supports the addition of multiple stackable mezzanine cards for added functionality.

Some key hardware components of the Qualcomm QRB2210 SOM are listed in the following table.

Key SOM Component Name Details
Processor QRB2210 Customized 64at 2.0 GHz
Qualcomm® Adreno™ 702 GPU at 845 MHz
Qualcomm® QDSP6 v66 DSP
Qualcomm Spectra™ 340L image processing engine
Qualcomm® Adreno™ 920 DPU display  
Power management IC Qualcomm® PM4125 PMU with 4 SMPS bucks and 22 LDOs Chipset clock subsystem and general housekeeping
Power management IC Qualcomm® PM8008 Camera power with 7 LDOs
SDRAM memory Micron MT53D512M32D2DS-053WT 2GB LPDDR4X (2x16 bit) 1804 MHz non-PoP
Flash memory Kingston EMMC16G-TB29 2GB eMMC 5.1
WLAN/Bluetooth chipset Qualcomm® WCN3950 WLAN 1 × 1 802.11a/b/g/n/ac, Bluetooth 5.0, and FM

Some key hardware components of the QRB4210 SOM are listed in the following table.

Key SOM component Name Details
Processor QRB4210 Customized 64‑bit v-8.0 compliant applications processor (Qualcomm® Kryo™ 260 CPU)
Adreno GPU 610 at 950 MHz with 64bit addressing
Qualcomm® Hexagon™ DSP with Hexagon Vector extensions (HVX) (dual HVX at 1.0 GHz)
Qualcomm Spectra™ 340T image processing engine
Adreno 921 DPU display
Power management IC Qualcomm® PM4250 PMU with 8 SMPS bucks and 24 LDOs Chipset clock subsystem and general housekeeping
Power management IC PM8008 Camera power with 7 LDOs
Power management IC Qualcomm® PMI632 Input power management, Quick Charge 2.0 and Quick Charge 3.0 support, Type-C and Micro USB connectors support, Battery current limiting (BCL) module
SDRAM memory Micron
MT53D512M32D2DS-053 WT:D
2GB LPDDR4X (2x16 bit) 1866 MHz non-PoP
Flash memory Kingston eMMC16G-TB29 16GB eMMC 5.1
WLAN/Bluetooth chipset Qualcomm® WCN3988 WLAN 1 × 1 802.11a/b/g/n/ac, Bluetooth 5.1, and FM
Interposer component Name Details
USB switch FUSB340 Enable DEBUG DEVICE MODE or NORMAL HOST MODE
JTAG JTAG JTAG debug connector

The following table describes some of the hardware components provided on the development kit mainboards.

Key Main Board Component Name Details
DSI to HDMI bridge  Lontium LT9611UCX 4k at 60 Hz HDMI support with I2S audio
USB hub Genesys GL3590 USB 3.1 Gen 2 10 Gb four port hub controller
USB to LAN Asix AX88179AQF USB 3.0 to 1 Gb Ethernet controller
Audio amplifiers x2 Qualcomm® WSA8815 Class-D soundwire audio amplifier
CAN bus controller Microchip MCP2518FD External CAN controller with SPI
IMU TDK ICM-42688-P 3-axis gyroscope and 3-axis accelerometer
Onboard digital microphone   TDK T5818 PDM digital MEMS microphone
USB connector USB Type-C USB Type-C with display port (direct connect to processor)
USB connector USB Type A (host mode USB 3.1 Gen 2 through USB hub
HDMI out HDMI Type A Up to 4k at 60 Hz with audio
Power DC power input +12 V from wall supply
Micro SD card Micro SD card Micro SD card tray
Antenna Antenna 0 2.4/5 GHz printed antenna
USB to UART FT230XQ-R USB to serial UART interface
Debug UART Micro USB connector Connector with FTDI USB to UART converter
Ethernet RJ45 ethernet connector Ethernet through USB 3.0 (1 Gb)
Audio Codec Qualcomm® WCD9370 The codec analog core and SoundWire interface

Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries.