Hardware Reference Guide
The Qualcomm® Robotics RB1 and Qualcomm® Robotics RB2 Development kits expand upon the 96Boards Consumer Edition (CE) Specification. They offer flexible options for development and commercialization. The development boards offer prototyping, off-the-shelf SOM solutions to speed commercialization, and flexibility for chip-on-board designs.
The Qualcomm Robotics RB1 and Qualcomm Robotics RB2 development kits consist of the Qualcomm® QRB2210 and Qualcomm® QRB4210 SOMs respectively. The SOMs are soldered down onto the interposer board and mounted on the robotics main board, which houses many peripheral interfaces and a robust expansion interface that supports the addition of multiple stackable mezzanine cards for added functionality.
Some key hardware components of the Qualcomm QRB2210 SOM are listed in the following table.
Key SOM Component | Name | Details |
Processor | QRB2210 | Customized 64at 2.0 GHz Qualcomm® Adreno™ 702 GPU at 845 MHz Qualcomm® QDSP6 v66 DSP Qualcomm Spectra™ 340L image processing engine Qualcomm® Adreno™ 920 DPU display |
Power management IC | Qualcomm® PM4125 | PMU with 4 SMPS bucks and 22 LDOs Chipset clock subsystem and general housekeeping |
Power management IC | Qualcomm® PM8008 | Camera power with 7 LDOs |
SDRAM memory | Micron MT53D512M32D2DS-053WT | 2GB LPDDR4X (2x16 bit) 1804 MHz non-PoP |
Flash memory | Kingston EMMC16G-TB29 | 2GB eMMC 5.1 |
WLAN/Bluetooth chipset | Qualcomm® WCN3950 | WLAN 1 × 1 802.11a/b/g/n/ac, Bluetooth 5.0, and FM |
Some key hardware components of the QRB4210 SOM are listed in the following table.
Key SOM component | Name | Details |
Processor | QRB4210 | Customized 64‑bit v-8.0 compliant applications processor (Qualcomm® Kryo™ 260 CPU) Adreno GPU 610 at 950 MHz with 64bit addressing Qualcomm® Hexagon™ DSP with Hexagon Vector extensions (HVX) (dual HVX at 1.0 GHz) Qualcomm Spectra™ 340T image processing engine Adreno 921 DPU display |
Power management IC | Qualcomm® PM4250 | PMU with 8 SMPS bucks and 24 LDOs Chipset clock subsystem and general housekeeping |
Power management IC | PM8008 | Camera power with 7 LDOs |
Power management IC | Qualcomm® PMI632 | Input power management, Quick Charge 2.0 and Quick Charge 3.0 support, Type-C and Micro USB connectors support, Battery current limiting (BCL) module |
SDRAM memory | Micron MT53D512M32D2DS-053 WT:D | 2GB LPDDR4X (2x16 bit) 1866 MHz non-PoP |
Flash memory | Kingston eMMC16G-TB29 | 16GB eMMC 5.1 |
WLAN/Bluetooth chipset | Qualcomm® WCN3988 | WLAN 1 × 1 802.11a/b/g/n/ac, Bluetooth 5.1, and FM |
Interposer component | Name | Details |
USB switch | FUSB340 | Enable DEBUG DEVICE MODE or NORMAL HOST MODE |
JTAG | JTAG | JTAG debug connector |
The following table describes some of the hardware components provided on the development kit mainboards.
Key Main Board Component | Name | Details |
DSI to HDMI bridge | Lontium LT9611UCX | 4k at 60 Hz HDMI support with I2S audio |
USB hub | Genesys GL3590 | USB 3.1 Gen 2 10 Gb four port hub controller |
USB to LAN | Asix AX88179AQF | USB 3.0 to 1 Gb Ethernet controller |
Audio amplifiers x2 | Qualcomm® WSA8815 | Class-D soundwire audio amplifier |
CAN bus controller | Microchip MCP2518FD | External CAN controller with SPI |
IMU | TDK ICM-42688-P | 3-axis gyroscope and 3-axis accelerometer |
Onboard digital microphone | TDK T5818 | PDM digital MEMS microphone |
USB connector | USB Type-C | USB Type-C with display port (direct connect to processor) |
USB connector | USB Type A (host mode | USB 3.1 Gen 2 through USB hub |
HDMI out | HDMI Type A | Up to 4k at 60 Hz with audio |
Power | DC power input | +12 V from wall supply |
Micro SD card | Micro SD card | Micro SD card tray |
Antenna | Antenna 0 | 2.4/5 GHz printed antenna |
USB to UART | FT230XQ-R | USB to serial UART interface |
Debug UART | Micro USB connector | Connector with FTDI USB to UART converter |
Ethernet | RJ45 ethernet connector | Ethernet through USB 3.0 (1 Gb) |
Audio Codec | Qualcomm® WCD9370 | The codec analog core and SoundWire interface |
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