Snapdragon® 8 Gen 2 Mobile Hardware Development Kit

A product of Qualcomm Technologies, Inc.

Purchase from Lantronix

Download Snapdragon 8 Gen 2 product brief

Start prototyping your next round of innovations in AI, game play, image/video capture and Wi-Fi 7 on the Snapdragon® 8 Gen 2 mobile hardware development kit (HDK). It’s a comprehensive, expandable kit for developing and evaluating on the Snapdragon 8 Gen 2 Mobile Platform.

The HDK exposes the top-of-the-line AI capabilities of the mobile platform, including improvements to the Qualcomm® AI Engine. You’ll be able to offer intuitive experiences like faster natural language processing with multi-language translation and transcription. And you can equip your apps with features like AI-assisted cinematic video capture, direct voice command and AI bots for gaming.

Use this Android T/13-based, single-board computer for open-frame access to the features of the Snapdragon 8 Gen 2 Mobile Platform. The kit allows manufacturers, hardware vendors and software developers to implement and test on Wi-Fi 7 (compliant with 802.11a/b/g/n/ac/ax/be) with the Qualcomm® FastConnect™ 7800 Mobile Connectivity System at up to 5.8 Gbps. For image capture, the kit exposes the Qualcomm Spectra™ ISP, supporting 18-bit triple Cognitive image signal processors (ISPs). It’s always-sensing camera with AI enhances Snapdragon Sight™ features including Bokeh Engine 2, real-time semantic segmentation for photo/video capture and up to 5x larger file sizes for professional quality.

The main components of the kit include:

  • Qualcomm® Kryo™ CPU
  • Qualcomm® Adreno™ GPU
  • Qualcomm AI Engine with Qualcomm® Hexagon™ digital signal processor
  • Qualcomm Spectra ISP
  • Snapdragon Elite Gaming™ Features
  • Qualcomm Aqstic™ smart speaker amplifier
  • 12GB LPDDR5 PoP memory and 256GB UFS4.0 storage

Connectors, ports and accessories available with the kit include:

  • Connectivity
    • FastConnect 7800
    • Wi-Fi 7 (802.11be), Wi-Fi 6 (802.11ax), Wi-Fi 6E, 802.11ac Wave 2, 802.11a/b/g/n
    • 2x2 antenna configuration
    • Bluetooth® 5.3 + BLE and backward compatible with Bluetooth 1.x, 2.x + EDR
    • NFC card connector reserved
  • I/O interfaces
    • M.2 Mkey
    • HDMI 2.0
    • 1x USB 3.1 Type C
    • 1x USB 2.0 micro-B (UART)
    • 1x SIM card
    • 6x MIPI CSI with support for 3D camera configuration
    • 2x 4-lane MIPI DSI or 2x 3-Trio MIPI DSI
    • 1x microSD/UFS card
  • Expansion headers for additional features
    • Headset
    • Sensor input/output
    • Audio input/output
  • Optional accessories
    • Display and expansion board: 6.8” FHD + 1080 x 2400 144Hz panel
    • Camera daughter card: 64MP + 50MP + 13MP + Time-of-Flight

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries.