Which Application Processor is Right for You?
Snapdragon Embedded Selection Guide
Qualcomm® Application processors were originally designed for mobile, but now can be embedded into virtually anything. Our processors support superior performance, low power consumption and integrated connectivity to make devices more aware, connected, intelligent and interactive.
Whatever stage of embedded development you’re at – whether prototyping new innovations, or scaling production to reach new customer opportunities – the APQ8016E and APQ8096SG application processors support a clear deployment path starting with development kits and single-board computers and scaling up to customer solutions, integration services and production-ready, customizable System-on-Modules (SOMs). The first step is choosing which application processor best supports your needs.
APQ8016E
The APQ8016E application processor is engineered to meet the demanding requirements of embedded computing applications with its high performance, energy efficiency, multimedia features and integrated connectivity. It is ideal for Internet of Things (IoT) use cases in smart home, industrial automation, digital media platers, smart surveillance and home appliances.
APQ8096SG
The APQ8096SG application processor supports premium tier, cutting edge applications for the IoT. It is engineered to support connected computing and powerful, yet power-efficient, multi-core processing for computer vision, artificial intelligence and immersive multimedia – all in one package.
Embedded Chipsets Feature Comparison
| APQ8016E | APQ8096SG | |
|---|---|---|
| Package | 12 x 14 x 0.96mm (760NSP, 0.4mm pitch) | 15.6 x 15 x 0.64mm* (994-pin NSP, 0.4mm pitch) * Height dimension does not include the memory device |
| Processor | Quad-core Arm-v8 Cortex A53, up to 1.2GHz per core, 32-/64-bit capable | Custom 64-bit Qualcomm® Kryo™ quad-core CPU @ up to 2.35GHz |
| Memory & Storage | LPDDR2/3 32-bit single channel non-PoP @ 533MHz eMMC 4.5 with DDR support, SDIO 3.0 (UHS-I) | LPDDR4 SDRAM dual-channel PoP @ 1866MHz UFS 2.0 gear 3 (1-lane), eMMC 5.1, SDIO 3.0 (UHS-I) |
| Connectivity | 802.11 b/g/n/ Wi-Fi, Bluetooth 4.2 | 802.11 ac 2x2 MU-MIMO 2.4GHz/5GHz Wi-Fi, Bluetooth 4.2 |
| Location | GPS | GPS and GLONASS |
| Graphics Accelerator | Qualcomm® Adreno™ 306 (up to 400MHz) | Adreno 530 with 64-bit addressing (up to 652.8 MHz) |
| DSP | Qualcomm® Hexagon™ QDSP6 V5 (up to 692 MHZ) | Hexagon 680 QDSP with dual-Hexagon vector processor (HVX-512) (up to 825 MHz) |
| Display Support | 1920x1200 1080p external displays supported 1x MIPI-DSI, HDMI via converter | 3840x2400 @60fps Up to 3 concurrent displays; 2 panels + external 2x MIPI-DSI, HDMI 2.0 |
| Camera Support | Single integrated ISP can support 1.5GP/s throughput and image sensors up to 13MP 1x MIPI-CSI | Dual 14-bit ISP: 28 MP & 13 MP @600 MHz 3x MIPI-CSI |
| Video Support | 1080p HD @ 30fps H.264 playback and capture | H.264 (AVC) playback & capture @4K60 H.265 (HEVC) playback @4K60 and capture @4K30 |
| Audio Support | 2x I2S (multi-channel) Up to - 3x analog mic, 2x digital mic, stereo headset, earpiece speaker driver | 3x quad channel I2S, 1x 8 channel I2S, 4x PCM, PDM, SlimBUS, HDMI 7.1 Up to - 6x analog mic, 6x digital mic, stereo headset, earpiece speaker driver, 6 analog inputs, 7 analog outputs |
| I/O Interfaces | 1x USB2.0 (Host, Device, or OTG) Up to - 122x GPIO, 6x I2C, 6x SPI, 2x UART, 3x UIM, 1x CCI | 1x USB 3.0 Gen 1 (Host, Device or OTG), 1x USB 2.0 (Host, Device or OTG) Up to - 150x GPIO, 12x I2C, 12x SPI, 12x UART, 12x UIM, 2x TSIF |